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Plating Equipment Product List and Ranking from 39 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

Plating Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. 上村工業 Osaka//Chemical
  2. 共和機器製作所 Saitama//Machine elements and parts
  3. テクニックジャパン 横浜実験室 Kanagawa//Resin/Plastic
  4. 4 SETO ENGINEERING 守谷事業所 Ibaraki//Industrial Machinery
  5. 5 ラットコーポレーション 本社：営業部・業務部 Aichi//Trading company/Wholesale
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Plating Equipment Product ranking

Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.

  1. Small item dedicated plating device 'Flow-through Plater RP-2' 上村工業
  2. Vertical Conveying Continuous Plating Device 'U-VCPS' 上村工業
  3. Surface treatment, electroplating, barrel plating: Case study of open-type detachable inclined barrel. 共和機器製作所
  4. 4 Plating equipment - Roll to roll plating equipment テクニックジャパン 横浜実験室
  5. 5 Surface treatment and barrel plating equipment "Super Barrel" *Case studies available. 共和機器製作所

Plating Equipment Product List

1～30 item / All 82 items

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New high-speed, high-quality fully automatic plating equipment series

New high-speed, high-quality fully automatic plating equipment series

Ultra-vibration flow technology that achieves more than double the speed of conventional plating!!

This is a next-generation plating device with high productivity that transmits vibrations with an output of 20Hz-40Hz to a multi-stage diaphragm equipped with a special mechanism. The ultra-vibrations of the diaphragm create a uniform high-speed turbulent agitation of the liquid in the surface treatment tank, completely resolving the shortcomings of conventional bubble agitation. Additionally, by introducing advanced agitation technology to plating solutions that cannot be agitated by bubbles, it achieves more than double the speed and high-quality plating technology compared to traditional methods, marking a significant leap and advancement in groundbreaking plating technology.

  • Other surface treatment equipment
  • Plating Equipment

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Zinc carrier-type barrel plating equipment

Zinc carrier-type barrel plating equipment

Zinc carrier-type barrel plating device

The zinc carrier-type barrel plating device developed by our company has significantly increased processing speed compared to previous devices with a tact time of 30 seconds. Additionally, by adopting a carrier method, we can efficiently process and greatly increase the amount handled per unit time. Being a compact processing device, it is ideal for post-processing of small lots with a variety of products. ★ Short tact time The usual tact time of 3 minutes has been reduced to 30 seconds. This dramatically reduces the post-processing labor hours. ★ Carrier method By adopting the carrier method, we have achieved efficient processing and increased the amount handled per unit time. ★ Suitable for small lots with a variety of products As a compact processing device, it is optimal for post-processing of small lots with a variety of products.

  • Other processing machines
  • Other surface treatment equipment
  • Other semiconductor manufacturing equipment
  • Plating Equipment

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Semi-automatic high-speed general-purpose plating device Prelude

Semi-automatic high-speed general-purpose plating device Prelude

Semi-automatic high-speed general-purpose plating device Prelude

The semi-automatic general-purpose plating device "Prelude" developed by our company is a high-speed plating device capable of performing processes such as cleaning and plating on the entire surface of the workpiece. Therefore, it does not leave behind any marks from jigs, which has been a conventional issue. The dedicated jigs can flexibly accommodate the shape of the workpiece. Thanks to innovations in the device structure, the amount of chemicals taken out is dramatically reduced compared to conventional products, lowering chemical costs. The entire device is covered, preventing the emission of harmful gases into the working environment.

  • Other processing machines
  • Other surface treatment equipment
  • Other semiconductor manufacturing equipment
  • Plating Equipment

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Plating device Rectifier

Plating device Rectifier

Best solution for ultra-thin films and ultra-precision plating.

Plating Equipment Rectifier Development and Adoption of High Frequency Pulse Module

  • メッキ装置.PNG
  • Plating Equipment
  • Plating Equipment

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Precision Tilt Barrel Plating Device 'Shachihoko(TM)'

Precision Tilt Barrel Plating Device 'Shachihoko(TM)'

Ideal for prototyping and production of precision micro components.

This is a set of the standard type inclined barrel plating device "Shachihoko(TM)." It includes the Shachihoko, heater, water tank, filter, anode plates, etc., making it very convenient for constructing fine plating processes (please specify the type of anode plates). The angle of the drum can be adjusted, allowing for adjustments based on the mixing condition and the occurrence of bubbles. Additionally, by changing the shape of the drum and the fineness of the mesh, it is possible to accommodate various items.

  • Other surface treatment equipment
  • Plating Equipment
  • Plating Equipment

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A-58 Small Roll-to-Roll Plating Device

A-58 Small Roll-to-Roll Plating Device

Continuous plating of imide tape and PET sheets up to approximately 200mm wide is possible.

This is a continuous plating device for long-length resin sheets such as polyimide and PET. It can be manufactured for both electroplating and electroless plating. It is capable of continuously processing a series of operations including pretreatment, rinsing, plating, and drying. We will manufacture according to your desired processing steps, chemical tank sizes, sheet widths, and sheet lengths. We are also happy to accommodate requests such as "I only want to move one tank" or "I want to move it within a beaker," so please feel free to consult with us.

  • Plastic utensils and containers
  • Plating Equipment
  • Plating Equipment

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Plating equipment - Roll to roll plating equipment

Plating equipment - Roll to roll plating equipment

Wide strip continuous plating equipment

It is possible to transport delicate strip materials or films, such as 50-micron thick polyimide film, by clipping them from above and below. When combined with a shield, stable plating can be achieved. Since power is supplied from the clips, there is no need for a power roll, which prevents damage to the product's surface. Additionally, the stainless steel belt that holds the clips guides the product, allowing for extremely low tension to be set on the product.

  • Other surface treatment equipment
  • Plating Equipment

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Plating device "TPM1000 exterior solder plating device"

Plating device "TPM1000 exterior solder plating device"

Due to the low variation in plating thickness and high reproducibility of the plating, inspections can be significantly reduced.

The plating device "TPM1000 exterior solder plating device" processes the lower end of a stainless steel belt into a wedge-shaped spring, allowing for the vertical loading of strip lead frames while simultaneously enabling horizontal transport and power supply. The development of this horizontal transport method has significantly improved the plating quality of strip lead frames, making it the global standard method. Inline deburring with high-pressure water is also possible. For more details, please contact us.

  • Other surface treatment equipment
  • Plating Equipment

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Plating device "Pattern plating device"

Plating device "Pattern plating device"

The advanced pattern plating equipment of the technique sets the industry standard.

The plating device "Pattern Plating Device" achieves a uniform plating layer even in high aspect ratio holes. The panel positioning system ensures that the positions of the panel and anode are kept horizontal during stirring. Our large-scale plating systems have a throughput of over 50-100 panels per hour. We manufacture chemicals for all processes involved in substrate plating and cater to all needs from equipment to chemicals. For more details, please contact us.

  • Other surface treatment equipment
  • Plating Equipment

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Plating equipment "MP80 terminal plating device"

Plating equipment "MP80 terminal plating device"

Numerous installation achievements. It is possible to reduce the amount of gold used by equalizing the plating thickness.

The plating device "MP80 terminal plating device" enables the reduction of gold usage through the uniformity of plating thickness. The technique boasts the largest installation record in the world for terminal plating devices. You can choose from a variety ranging from the Mini FFP with a processing speed of 0.45m per minute and a footprint of 3.3m x 0.9m to the MP80 with a speed of 3.6m per minute. Based on the largest number of installations in the world, we provide systems and support tailored to your company's needs. Please contact us for more details.

  • Other surface treatment equipment
  • Plating Equipment

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Electrolytic copper plating device (non-dissolving copper plating)

Electrolytic copper plating device (non-dissolving copper plating)

We would like to introduce a device that performs copper plating on the product pattern section using a vertical transport method.

The device can perform copper plating on the product pattern section. The process involves pre-treatment of the film foil, copper plating, rinsing, and drying, and is carried out using a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the device, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 1.0m/min ■ Material width: MAX 300mm ■ Material thickness: 25μm to 50μm ■ Processing surface: Both sides *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment
  • Plating Equipment
  • Plating Equipment

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Non-electrolytic copper plating device

Non-electrolytic copper plating device

No scratches or wrinkles during transport! By adopting an UP/DOWN processing method in the processing section, it is possible to shorten the overall length of the device.

The device can perform copper plating treatment on a "conductive ink" pattern formed in a resin film using an electroless method. Thin materials are transported without scratches or wrinkles using our transport technology. By adopting UP/DOWN processing methods in the treatment section, it is possible to shorten the overall length of the device. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m/min (Max 1.5m/min) ■ Material width: MAX 600mm ■ Material thickness: 50μm and above ■ Processing surface: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment
  • Plating Equipment
  • Plating Equipment

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Semiconductor and Printed Circuit Board Horizontal Manufacturing Equipment - Desmia Machine (Plating Process)

Semiconductor and Printed Circuit Board Horizontal Manufacturing Equipment - Desmia Machine (Plating Process)

Achieving complete smear removal! The device design takes maintenance into consideration.

Introducing the desmear machine for plating processes handled by Fujikiko Co., Ltd. It accommodates everything from single-sided PCBs to flexible PCBs using Roll to Roll. With an optimal spray design, it achieves complete smear removal. Additionally, the equipment is designed with maintenance in mind. 【Features】 ■ Accommodates everything from single-sided PCBs to flexible PCBs using Roll to Roll ■ Optimal spray design ■ Achieves complete smear removal ■ Equipment design considering maintenance *For more details, please refer to the PDF document or feel free to contact us.

  • Substrate transport device (loader/unloader)
  • Circuit board processing machine
  • Plating Equipment
  • Plating Equipment

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Electrolytic/non-electrolytic plating equipment

Electrolytic/non-electrolytic plating equipment

We offer a unique plating process tailored just for you, with keywords such as magnetic films, high-speed plating, uniform film thickness, and custom-made.

Regardless of the type of solution, we can propose plating equipment and processes tailored to your objectives. Most of the ordered equipment will have original specifications, allowing us to provide the equipment you desire. 1. Four types of plating methods: Supporting plating methods and processes according to your objectives. 2. Film thickness uniformity within ±2%: Face-up method. 3. Magnetic film plating compatible with all compositions: Production of plating solutions and film formation compatible with all compositions. 4. Supplied to all companies in the HDD industry: Magnetic film plating equipment.

  • Capacitor
  • Inductor Coil
  • Oscillator
  • Plating Equipment

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Product Information: Equipment, Labor-saving Devices

Product Information: Equipment, Labor-saving Devices

Introduction of Tsukuba Kiko's achievements in manufacturing equipment and labor-saving devices.

This is an introduction to the manufacturing achievements of Tsukuba Kiko's equipment and labor-saving devices.

  • Other semiconductor manufacturing equipment
  • Plating Equipment

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Introduction to Toa Electronics' Wet Process Business

Introduction to Toa Electronics' Wet Process Business

Technological capabilities that contribute to the development and practical application of advanced materials.

We propose a surface treatment device that condenses our unique manufacturing technology. In recent years, with the increasing complexity of three major types of circuits—flexible printed circuits (FPC), rigid printed circuits, and packages—we handle various surface treatment devices such as plating equipment, developing, etching, and stripping equipment (DES), and cleaning devices that respond to the trends of high density and miniaturization. We take full responsibility for the design, manufacturing, assembly, construction, and maintenance of various devices.

  • Etching Equipment
  • Plating Equipment
  • Other surface treatment equipment
  • Plating Equipment

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Bath plating device "Terra Series"

Bath plating device "Terra Series"

Anyone can easily achieve beautiful plating! Introducing a bath plating device equipped with an electrolytic degreasing function.

The quality of plating is determined by the cleaning process before treatment. The "Koki (Teri) Series" is equipped with an electrolytic degreasing function, making it easy for anyone to achieve beautiful plating. We offer the "Koki Junior MM-10J," which features electrolytic degreasing, as well as the "Koki MM-10," which includes electrolytic polishing and degreasing functions, and the "Koki MM-20T," which is a medium-sized universal plating device with constant voltage and current for electrolytic polishing and degreasing. 【Product Lineup】 ■ Small, low-cost, high-performance plating device "Koki Junior MM-10J" ■ Low-cost, high-performance plating device "Koki MM-10" equipped with electrolytic polishing function ■ Medium-sized universal plating device "Koki MM-20T" *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • Other machine elements
  • Heating device
  • Plating Equipment

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Dedicated vertical transport plating device for printed circuit boards 'UF Carrier'

Dedicated vertical transport plating device for printed circuit boards 'UF Carrier'

Stable functionality! Three types available: side-running, ceiling-running, and gantry types.

The "UF Career" is a fully automatic programmable plating device that has received extremely high evaluations and achievements in terms of functionality and reliability since its release. It is a system that can handle everything from small items to large items, as well as a mixture of various processing items, and it automatically processes them through programming methods, such as rack processing, barrel processing, and basket processing. The stable functionality and the rich system that accommodates various specifications can be safely used in the precise manufacturing process of printed circuit boards. Additionally, we also offer a fully automatic plating device with a continuous transport system known as the "Elevator Type." 【Features】 ■ A system that mixes various processing items ■ Automatic processing through programming methods ■ A rich system that accommodates stable functionality and various specifications ■ Safe for use in the precise manufacturing process of printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Small item dedicated plating device 'Flow-through Plater RP-2'

Small item dedicated plating device 'Flow-through Plater RP-2'

A series of processes such as the first plating, rinsing, and second plating can be performed in one module!

The "Flow-through Plating System RP-2" is a fully automated plating device specifically designed for small items. A series of processes such as the first plating, rinsing, and second plating can be performed within a single module, and if the processing volume increases, additional modules can be added to accommodate it. Based on this product, we also offer the "RP-2FA," which has been developed to enhance productivity and achieve labor-saving and unmanned operations through full automation. 【Features】 ■ Capable of high current density (high-speed) plating ■ Plating of fine powders (10-50μm) is possible by changing the filter ■ The amount of liquid carried in/out and the generation of gas/mist are drastically reduced compared to conventional devices ■ A series of processes such as the first plating, rinsing, and second plating can be performed within a single module ■ If the processing volume increases, additional modules can be added to accommodate it *For more details, please refer to the PDF document or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Vertical non-electrolytic and electrolytic plating equipment

Vertical non-electrolytic and electrolytic plating equipment

Vertical plating device for thin materials.

Vertical plating device for thin materials For more details, please refer to the catalog or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Vertical electroplating copper device

Vertical electroplating copper device

Product compatibility for hangers and jigs! Jigs can be adjusted up and down, left and right, making them useful when dealing with a diverse range of products.

We would like to introduce the vertical electroplating copper plating equipment. Special JIG: Customizable according to customer company specifications and product sizes. Accurate current authorization is composed of two rectifiers per product. The configuration of the front part of the equipment is as follows: Equipment height: 4,000 (Max 610 product standard) Equipment width: 7,000 (including washing equipment). 【Features】 ■ Compatibility with hangers and jigs ■ Uniform maintenance of spacing between substrates in the plating bath ■ Rectifier control ■ Defective hanger checker ■ Substrate guide within the tank *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Plating Equipment

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Surface Treatment System Plating Equipment Comprehensive Catalog

Surface Treatment System Plating Equipment Comprehensive Catalog

We will introduce continuous plating equipment and barrel plating equipment, among others.

The surface treatment system comprehensive catalog for plating equipment includes various products such as the "Continuous Plating Equipment," which allows for minimal plating of only the necessary parts for electronic components; the "Barrel Plating Equipment," which uses barrels to plate small components like electronic parts; the "Horizontal Desmear Equipment," which achieves improved maintenance with a simple design; and the "Hard Chrome Plating Equipment," which performs hard chrome plating on engine piston rings for automobiles, among many others. 【Featured Products】 ○ Continuous Plating Equipment ○ Barrel Plating Equipment ○ Printed Circuit Board Plating Equipment ○ Horizontal Desmear Equipment ○ Hard Chrome Plating Equipment, etc. For more details, please contact us or download the catalog.

  • Other surface treatment equipment
  • Plating Equipment

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Icy Carrier Fully Automatic Plating Equipment

Icy Carrier Fully Automatic Plating Equipment

Achieve labor savings and high productivity with high-speed carriers! With computer control, we flexibly respond to diverse needs.

The "Icy Carrier Fully Automatic Plating Device" flexibly responds to diverse needs with computer control. It achieves labor-saving and high productivity with a high-speed carrier. The selection of processes from loading to pretreatment, plating, and unloading, as well as program changes, can be easily made. Additionally, safety measures against accidents (such as carrier collisions, overruns, and double dropping of workpieces) are thoroughly in place. 【Features】 ■ Quickly responds to a wide variety of processing contents (7,000 types) with fully automatic processing ■ Easy selection of processes and program changes ■ High-speed carrier operation (500mm/s) shortens cycle time ■ Soft start and soft stop ensure that workpieces are transported without shock ■ Comprehensive safety measures against potential accidents *For more details, please refer to the PDF document or feel free to contact us.

  • Plating Equipment
  • Other conveying machines
  • Plating Equipment

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High-speed laser plating device 'HLP-DCL100'

High-speed laser plating device 'HLP-DCL100'

Efficient experiments are possible! Introducing an on-demand film formation device using laser sintering technology.

The "HLP-DCL100" is a high-speed laser plating device that sinters metal nanoparticle paste with a laser to form a metal film. It can create films on a wide range of metal materials, including standard steel. Additionally, it can form films on substrates such as copper, which are significantly affected by heat in conventional furnace firing. Furthermore, the monitoring function allows for the evaluation of the sample condition at each stage of the process. 【Features】 ■ Joint research and development with M&M Laboratory and Ibaraki University ■ Capable of forming films on a wide range of metal materials, including standard steel ■ Can be processed in atmospheric and inert gas environments ■ Comfortable user interface operable via a touch panel screen ■ Efficient experiments enabled through process monitoring ■ Compact desktop design *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • Plating Equipment

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Jet-type inclined/horizontal plating device 'HOBJET(C)'

Jet-type inclined/horizontal plating device 'HOBJET(C)'

Solving surface treatment for small quantities and diverse types of electronic components that require strict quality standards!

The 『HOBJET(C)』 is a jet plating device that allows for processing with the barrel table remaining in place for both pre- and post-processing, and also facilitates easy sampling during processing. It can be applied widely, from small-scale prototypes to mass production. With a cassette system, moving between tanks for pre-treatment, plating, and post-treatment is effortless. 【Features】 ■ Improvement in plating quality and reduction in thickness variation ■ No lid design prevents jamming ■ Easy to attach and detach due to the cassette system ■ Barrel heads can be freely exchanged ■ The lead (cathode) tip is replaceable with a screw type, etc. *For more details, please download the PDF or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Elevator-type barrel plating device

Elevator-type barrel plating device

It is a highly productive and high operating rate production facility! We also accept custom design and manufacturing.

The "elevator-type barrel plating device" is a plating apparatus that allows for the plating of workpieces that cannot be attached to stationary jigs, such as bolts, nuts, and washers. It operates by placing these workpieces into a barrel drum, rotating them while passing current through lead wires to deposit a film thickness. A connected shaft with a diameter of 120mm is erected at both ends of the device, with large sprockets of approximately 1,000mm in diameter positioned above and below. A hanger is attached at a 1,000mm pitch to the lateral drive unit, which has a mechanism for vertical movement. Surrounding this setup are pre-treatment and plating tanks, and the hanger is moved every 90 to 360 seconds (6 minutes) to carry out the plating process. *For more details, please feel free to contact us.*

  • Plating Equipment
  • Plating Equipment

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Plating device "PEN-MEKKI MINI"

Plating device "PEN-MEKKI MINI"

The liquid and pen are different types! Suitable for pinpoint plating and partial plating after repairs.

The "PEN-MEKKI MINI" is a pencil-type plating device. Since the liquid and the plating pen are separate, you can use only the necessary amount of liquid, making it economical and waste-free. It is also very useful for repairs and sample creation as it can be done in a short time. Additionally, when changing the plating liquid, you only need to replace the pen tip. The fine tip allows for use on complex items and even on neck chains. 【Features】 ■ Easy and clean partial plating ■ The liquid and plating pen are separate, allowing for economical use of only the necessary amount of liquid ■ Very useful for repairs and sample creation as it can be done in a short time ■ Simply replace the pen tip when changing the plating liquid ■ Suitable for partial plating after repairs with a laser welder *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Plating Equipment

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Medium-sized universal plating device "Light TERI Shine MM-18T"

Medium-sized universal plating device "Light TERI Shine MM-18T"

You can choose the beaker size! The liquid is stirred, allowing for uniform plating.

The "Hikari TERI Radiance MM-18T" is a medium-sized versatile plating device that allows for stable and beautiful plating due to its constant voltage and constant current features. The beaker sizes range from 1 liter to 5 liters. The liquid is stirred, enabling uniform plating. Additionally, we offer various plating solutions as options, including plating pen sets, rhodium plating, K24, K18 plating, and glossy nickel plating. 【Features】 ■ Constant voltage and constant current type ■ Enables stable and beautiful plating ■ Uniform plating due to liquid stirring *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • Plating Equipment

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Examples of surface treatment, electroplating, and barrel plating with a four-sided drop design barrel lid.

Examples of surface treatment, electroplating, and barrel plating with a four-sided drop design barrel lid.

Countermeasures against clamping defects for ultra-small precision parts and ultra-thin sheet parts! Suppressing the time-dependent deformation of barrels for longer lifespan! For surface treatment, electroplating, and barrel plating!

We would like to introduce a case study that implemented our original "four-sided drop lid (slide opening and closing mechanism)." In terms of design, we manufactured with a lid clearance of at least 0.3 mm for large barrels, 0.2 mm for medium barrels, and 0.1 mm for small barrels, addressing issues with the clamping of extremely small and thin parts. As a result, we successfully eliminated unnecessary sorting processes after the plating process, achieving significant cost reductions. [Case Study] <Problems> ■ We want to eliminate product lid clamping defects and reduce costs. ■ We aim to extend the lifespan by suppressing barrel deformation. <Implementation Effects> ■ Achieved significant cost reductions. ■ Enabled longer lifespan than before. *For more details, please refer to the PDF document or feel free to contact us.

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  • Other surface treatment equipment
  • Plating Equipment

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Surface treatment, electroplating, barrel plating: Case study of open-type detachable inclined barrel.

Surface treatment, electroplating, barrel plating: Case study of open-type detachable inclined barrel.

Improve the refresh rate of the processing liquid in micro-hole barrels or mesh-coated barrels! It enables a reduction in surface treatment and plating time!

Here is a case study introducing the "open-type inclined barrel" equipped with a liquid circulation pump. In a customer’s operation where ultra-fine precision parts are plated using a conventional sealed barrel with a lid opening and closing, the liquid renewal inside and outside the barrel was poor due to the sealed design. As a result, the metal concentration was depleted during the plating process, leading to defects caused by voltage issues. In response, we proposed our product. Additionally, the design allows for easy one-touch detachment of the barrel, enabling the preparation of multiple barrels with different sizes and specifications for various plating products, thus accommodating small-batch, diverse plating processes. 【Case Study】 <Implementation Effects> ■ Capable of handling small-batch, diverse plating processes ■ Improved uniformity of the plating film ■ Enhanced liquid renewal due to the circulation pump ■ Reduction of sticking and floating of ultra-fine products inside the barrel achieved through radial liquid ejection *For more details, please refer to the PDF document or feel free to contact us.

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  • Other surface treatment equipment
  • Plating Equipment

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