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Plating Equipment Product List and Ranking from 37 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

Plating Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. 共和機器製作所 Saitama//Machine elements and parts
  2. 上村工業 Osaka//Chemical
  3. テクニックジャパン Kanagawa//Resin/Plastic 横浜実験室
  4. 4 山本鍍金試験器 Tokyo//Resin/Plastic
  5. 5 SETO ENGINEERING Ibaraki//Industrial Machinery 守谷事業所
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Plating Equipment Product ranking

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. Small item dedicated plating device 'Flow-through Plater RP-2' 上村工業
  2. Plating equipment - Roll to roll plating equipment テクニックジャパン 横浜実験室
  3. Surface treatment, electroplating, barrel plating: Case study of open-type detachable inclined barrel. 共和機器製作所
  4. Surface treatment and electroplating: Fully automatic barrel plating equipment with IH carrier system. 共和機器製作所
  5. 4 Automatic barrel plating equipment 増田工業 我孫子本店

Plating Equipment Product List

1～15 item / All 82 items

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New high-speed, high-quality fully automatic plating equipment series

New high-speed, high-quality fully automatic plating equipment series

Ultra-vibration flow technology that achieves more than double the speed of conventional plating!!

This is a next-generation plating device with high productivity that transmits vibrations with an output of 20Hz-40Hz to a multi-stage diaphragm equipped with a special mechanism. The ultra-vibrations of the diaphragm create a uniform high-speed turbulent agitation of the liquid in the surface treatment tank, completely resolving the shortcomings of conventional bubble agitation. Additionally, by introducing advanced agitation technology to plating solutions that cannot be agitated by bubbles, it achieves more than double the speed and high-quality plating technology compared to traditional methods, marking a significant leap and advancement in groundbreaking plating technology.

  • Other surface treatment equipment

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Zinc carrier-type barrel plating equipment

Zinc carrier-type barrel plating equipment

Zinc carrier-type barrel plating device

The zinc carrier-type barrel plating device developed by our company has significantly increased processing speed compared to previous devices with a tact time of 30 seconds. Additionally, by adopting a carrier method, we can efficiently process and greatly increase the amount handled per unit time. Being a compact processing device, it is ideal for post-processing of small lots with a variety of products. ★ Short tact time The usual tact time of 3 minutes has been reduced to 30 seconds. This dramatically reduces the post-processing labor hours. ★ Carrier method By adopting the carrier method, we have achieved efficient processing and increased the amount handled per unit time. ★ Suitable for small lots with a variety of products As a compact processing device, it is optimal for post-processing of small lots with a variety of products.

  • Other processing machines
  • Other surface treatment equipment
  • Other semiconductor manufacturing equipment

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Semi-automatic high-speed general-purpose plating device Prelude

Semi-automatic high-speed general-purpose plating device Prelude

Semi-automatic high-speed general-purpose plating device Prelude

The semi-automatic general-purpose plating device "Prelude" developed by our company is a high-speed plating device capable of performing processes such as cleaning and plating on the entire surface of the workpiece. Therefore, it does not leave behind any marks from jigs, which has been a conventional issue. The dedicated jigs can flexibly accommodate the shape of the workpiece. Thanks to innovations in the device structure, the amount of chemicals taken out is dramatically reduced compared to conventional products, lowering chemical costs. The entire device is covered, preventing the emission of harmful gases into the working environment.

  • Other processing machines
  • Other surface treatment equipment
  • Other semiconductor manufacturing equipment

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Precision Tilt Barrel Plating Device 'Shachihoko(TM)'

Precision Tilt Barrel Plating Device 'Shachihoko(TM)'

Ideal for prototyping and production of precision micro components.

This is a set of the standard type inclined barrel plating device "Shachihoko(TM)." It includes the Shachihoko, heater, water tank, filter, anode plates, etc., making it very convenient for constructing fine plating processes (please specify the type of anode plates). The angle of the drum can be adjusted, allowing for adjustments based on the mixing condition and the occurrence of bubbles. Additionally, by changing the shape of the drum and the fineness of the mesh, it is possible to accommodate various items.

  • Other surface treatment equipment
  • Plating Equipment

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A-58 Small Roll-to-Roll Plating Device

A-58 Small Roll-to-Roll Plating Device

Continuous plating of imide tape and PET sheets up to approximately 200mm wide is possible.

This is a continuous plating device for long-length resin sheets such as polyimide and PET. It can be manufactured for both electroplating and electroless plating. It is capable of continuously processing a series of operations including pretreatment, rinsing, plating, and drying. We will manufacture according to your desired processing steps, chemical tank sizes, sheet widths, and sheet lengths. We are also happy to accommodate requests such as "I only want to move one tank" or "I want to move it within a beaker," so please feel free to consult with us.

  • Plastic utensils and containers
  • Plating Equipment

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Plating equipment - tumble plating equipment

Plating equipment - tumble plating equipment

A completely new concept of a rotary plating device.

Each processing station has a container called a compartment that rotates parts on a belt, allowing only the parts to move between stations for processing. Since the compartment is open, the chemical solution is directly sprayed in, and the current flows easily, significantly improving the plating speed. Additionally, due to the stationary nature of the container and the unique rinsing method, the amount of liquid extracted can be improved by about 85% compared to a barrel, greatly reducing chemical costs and the burden on the drainage system.

  • Other surface treatment equipment

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Plating equipment - Roll to roll plating equipment

Plating equipment - Roll to roll plating equipment

Wide strip continuous plating equipment

It is possible to transport delicate strip materials or films, such as 50-micron thick polyimide film, by clipping them from above and below. When combined with a shield, stable plating can be achieved. Since power is supplied from the clips, there is no need for a power roll, which prevents damage to the product's surface. Additionally, the stainless steel belt that holds the clips guides the product, allowing for extremely low tension to be set on the product.

  • Other surface treatment equipment

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Plating device "TPM1000 exterior solder plating device"

Plating device "TPM1000 exterior solder plating device"

Due to the low variation in plating thickness and high reproducibility of the plating, inspections can be significantly reduced.

The plating device "TPM1000 exterior solder plating device" processes the lower end of a stainless steel belt into a wedge-shaped spring, allowing for the vertical loading of strip lead frames while simultaneously enabling horizontal transport and power supply. The development of this horizontal transport method has significantly improved the plating quality of strip lead frames, making it the global standard method. Inline deburring with high-pressure water is also possible. For more details, please contact us.

  • Other surface treatment equipment

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Plating device "Pattern plating device"

Plating device "Pattern plating device"

The advanced pattern plating equipment of the technique sets the industry standard.

The plating device "Pattern Plating Device" achieves a uniform plating layer even in high aspect ratio holes. The panel positioning system ensures that the positions of the panel and anode are kept horizontal during stirring. Our large-scale plating systems have a throughput of over 50-100 panels per hour. We manufacture chemicals for all processes involved in substrate plating and cater to all needs from equipment to chemicals. For more details, please contact us.

  • Other surface treatment equipment

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Plating equipment "MP80 terminal plating device"

Plating equipment "MP80 terminal plating device"

Numerous installation achievements. It is possible to reduce the amount of gold used by equalizing the plating thickness.

The plating device "MP80 terminal plating device" enables the reduction of gold usage through the uniformity of plating thickness. The technique boasts the largest installation record in the world for terminal plating devices. You can choose from a variety ranging from the Mini FFP with a processing speed of 0.45m per minute and a footprint of 3.3m x 0.9m to the MP80 with a speed of 3.6m per minute. Based on the largest number of installations in the world, we provide systems and support tailored to your company's needs. Please contact us for more details.

  • Other surface treatment equipment

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Electrolytic copper plating device (non-dissolving copper plating)

Electrolytic copper plating device (non-dissolving copper plating)

We would like to introduce a device that performs copper plating on the product pattern section using a vertical transport method.

The device can perform copper plating on the product pattern section. The process involves pre-treatment of the film foil, copper plating, rinsing, and drying, and is carried out using a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the device, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 1.0m/min ■ Material width: MAX 300mm ■ Material thickness: 25μm to 50μm ■ Processing surface: Both sides *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment
  • Plating Equipment

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Non-electrolytic copper plating device

Non-electrolytic copper plating device

No scratches or wrinkles during transport! By adopting an UP/DOWN processing method in the processing section, it is possible to shorten the overall length of the device.

The device can perform copper plating treatment on a "conductive ink" pattern formed in a resin film using an electroless method. Thin materials are transported without scratches or wrinkles using our transport technology. By adopting UP/DOWN processing methods in the treatment section, it is possible to shorten the overall length of the device. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m/min (Max 1.5m/min) ■ Material width: MAX 600mm ■ Material thickness: 50μm and above ■ Processing surface: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment
  • Plating Equipment

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What is roll to roll? ~Plating Edition Part 2~

What is roll to roll? ~Plating Edition Part 2~

We provide an easy-to-understand explanation of the "electrolytic plating" using the roll-to-roll method!

This document introduces the plating process conducted using a roll-to-roll method. There are various methods and types of plating performed using the roll-to-roll technique. Among them, we explain the electrolytic plating. In the section on types of electrolytic plating, we also introduce the features, conditions, and challenges. As mentioned in "Plating Part 1," both electrolytic and electroless plating have their own characteristics, so it is necessary to choose the plating that leverages those characteristics depending on the product being made. Please take a moment to read it. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other machine elements

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Semiconductor and Printed Circuit Board Horizontal Manufacturing Equipment - Desmia Machine (Plating Process)

Semiconductor and Printed Circuit Board Horizontal Manufacturing Equipment - Desmia Machine (Plating Process)

Achieving complete smear removal! The device design takes maintenance into consideration.

Introducing the desmear machine for plating processes handled by Fujikiko Co., Ltd. It accommodates everything from single-sided PCBs to flexible PCBs using Roll to Roll. With an optimal spray design, it achieves complete smear removal. Additionally, the equipment is designed with maintenance in mind. 【Features】 ■ Accommodates everything from single-sided PCBs to flexible PCBs using Roll to Roll ■ Optimal spray design ■ Achieves complete smear removal ■ Equipment design considering maintenance *For more details, please refer to the PDF document or feel free to contact us.

  • Substrate transport device (loader/unloader)
  • Circuit board processing machine
  • Plating Equipment

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